Latest articles on AI, technology, and software development.
Compute Express Link 3.0 fabric switches are now shipping in production colocation environments, letting operators pool DRAM across hosts instead of stranding it inside individual servers.
Intel, Samsung, and Absolics are racing to commercialize glass substrates that solve the warpage and density limits organic packaging can no longer handle at AI-chip scale.
AWS Graviton5, Google Axion, and Microsoft Cobalt now make up close to half of new hyperscaler compute capacity, and the shift away from x86 has stopped being just a cost play.
AMD's new Robotics Partner Network charges no licensing or membership fees across all four tiers. That is not generosity — it is a bet that silicon attach rate matters more than software lock-in in physical AI.
AI clusters now move data faster than copper wiring can physically handle. Silicon photonics and co-packaged optics are shipping in 2026 to fix that — here's what's actually changing and why it matters for anyone running or buying AI compute.
Samsung, SK Hynix, and Micron have quietly redirected their factories toward AI-grade HBM memory, and the fallout is a doubling of DRAM prices and a permanent squeeze on everything from smartphones to gaming PCs.
GPU compute keeps scaling faster than memory bandwidth. HBM4 doubles the interface width to close the gap, but it's arriving sold out, expensive, and still not enough. Here's why the memory wall, not FLOPS, now decides who wins the AI hardware race.
The Blackwell GPU generation is not just faster than Hopper — it has changed the unit economics of AI training and inference so drastically that data centers, cloud pricing, and who can actually compete in AI are all shifting around it.
Compute Express Link decouples memory from CPUs and GPUs, enabling shared memory pools across entire server racks. For LLM inference and AI training, this changes the economics of data center design.
Qualcomm's Snapdragon X Elite runs Stable Diffusion in 7 seconds on-device. Intel and AMD are catching up. The race to define what AI PC means in practice is accelerating — and the winner depends on what you actually need.
Apple's M-series chips forced a reckoning in the PC industry. Two years later, Qualcomm's Snapdragon X Elite and Intel's Lunar Lake show the competition has internalized the lesson — but neither has fully closed the gap on efficiency or software ecosystem depth.
LPCAMM2 is the first memory standard to combine LPDDR5X efficiency with a removable module design, ending a decade of soldered-only RAM in thin-and-light laptops. Here's what it means for performance, repairability, and how long you'll keep your next laptop.