Breaking news and updates from the world of technology.
The Trump administration told ASML that one of its extreme ultraviolet lithography machines may have violated export controls by reaching China. ASML CEO Christophe Fouquet flatly denies it, saying the company tracks every EUV system ever built.
SK Hynix has begun delivering qualification samples of its next-generation HBM4E memory to major AI customers, offering 20 percent better power efficiency and 17 percent lower heat resistance than HBM4 — ahead of Nvidia's Rubin Ultra platform ramp.
President Trump announced on Truth Social that Apple has agreed to work with Intel to produce chips on American soil. Intel's stock jumped as much as 11 percent on the news, while Apple and Intel have yet to issue official statements.
Amazon Web Services is exploring selling its custom Trainium AI chips to third-party companies, with Andy Jassy estimating a potential $50 billion annual run rate — a direct challenge to Nvidia's data center dominance.
Samsung Display has unveiled a 31.5-inch QD-OLED panel at Computex 2026 that combines 4K (3840×2160) resolution with a 360Hz refresh rate — a combination previously considered unachievable on a self-emissive display. The technology behind it, called Penta Tandem, uses five stacked blue OLED layers instead of four. A Dual Mode drops to 1080p and pushes the refresh rate to 680Hz for competitive gaming. Actual monitors are expected in late 2026 or early 2027.
Computex 2026 produced the most significant PC hardware shift in years: Nvidia unveiled RTX Spark, a superchip combining 20 ARM cores with a Blackwell GPU and 128 GB of unified memory — its first consumer PC processor. Thirty laptops and ten desktops arrive in fall 2026. Simultaneously, Nvidia is targeting $20 billion in data centre CPU revenue with its Vera chip. Intel, AMD, and Qualcomm all face a different competitive landscape than they did a week ago.
Jensen Huang unveiled the N1X at Computex 2026 tonight -- an ARM-based SoC with a 20-core CPU and RTX 5070-class GPU built in, backed by Dell, Lenovo, ASUS, MSI, and Microsoft.
Announced ahead of Computex 2026, the Snapdragon C platform targets budget Windows 11 machines starting around $300 — a price tier long dominated by Chromebooks and cheap x86 hardware.
Samsung has begun shipping samples of its 12-layer HBM4E memory to major AI customers — the first time the next-generation standard has reached this stacking depth. The chips deliver up to 3.6 TB/s bandwidth and 48 GB capacity, a 30% jump over HBM4.
Huawei unveiled a new chip design methodology called LogicFolding at ISCAS 2026 that uses 3D-stacked logic circuits to reach 1.4nm-class transistor density — bypassing the EUV lithography machines that US sanctions have placed out of reach.
TSMC's profits surged by 58% and its revenue forecast was raised to over 30% growth, driven by the massive global demand for high-performance AI chips.
A verified account with the @elonmusk handle also recently showed up on Instagram, as the billionaire prepares to take his rocket company SpaceX public.