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Samsung ships industry-first 12-layer HBM4E with 3.6 TB/s bandwidth
Computers & Hardware

Samsung ships industry-first 12-layer HBM4E with 3.6 TB/s bandwidth

Samsung has begun shipping samples of its 12-layer HBM4E memory to major AI customers — the first time the next-generation standard has reached this stacking depth. The chips deliver up to 3.6 TB/s bandwidth and 48 GB capacity, a 30% jump over HBM4.

Samsung Newsroom
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